Global Advanced Research Journal of Engineering, Technology and Innovation (ISSN: 2315-5124) August 2015 Vol. 4(4), pp 051-068

Copyright © 2015 Global Advanced Research Journals   

 

Original Research Articles

A Possible Way to Grasp Electronic Noise, via some Transfer Impedance Methods, in Three-Dimensional Nanoscale Circuit Substrates

Yue MA , Francis Calmon, Jacques Verdier and Christian Gontrand

Université de Lyon, INSA- Lyon, INL,  CNRS- UMR5270, Villeurbanne,F- 69621, France.Contact author: Christian.Gontrand@insa-lyon.fr

Accepted 27 July 2015

Abstract 

3D Si integration seems a right way to go and compete with Moore’s law (more than Moore versus more Moore). However, it is still a long way to go. A crippling problem, not really considered currently, concerns the noise propagation, especially when complex 3D interconnects, in the radiofrequency range and at a nano-scale, is embedded into the substrate. First of all, from any source, we calculate the spreading impedance. Compact Green kernel, over or into a multi-layered substrate, is derived by solving Poisson's equation analytically. The Discrete Cosine Transform and its variations are used for rapid evaluation. Using this technique, the substrate coupling and loss in IC's can be analyzed. We implement our algorithm in MATLAB. Thus, it permits to extract 3D impedances between any two embedded contacts, real or virtual. A third point is  we can calculate from any contact source in the bulk where appear some current fluctuations, some voltage fluctuations at any other embedded contacts, and get transfer impedances, a key item for noise propagation calculations; we think that is the very originality of this paper. We investigate our models on both analytical and numerical methods, like finite elements-based simulations. This extended model enables one to extract substrate impedance, parasitic elements and noises between any two points embedded into the substrate. They are fully compatible with SPICE-like solvers and should allow an investigation in depth of the impact of buried contacts on circuit performance. Concerning noise calculations, we introduce the Impedance Field Method; it describes the response of local noise sources to target points, both points being anywhere into the bulk, and possibly to   terminals. Some physical noise models, GR-like, are introduced. The implementation of noise analysis into our simulator is begun and first results of the calculation into the substrate are shown. 

Keywords: Electronic Noise, Transfer Impedance Methods, Three-Dimensional Nanoscale Circuit Substrates

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